Die Bonding at die-bonding.net

Die Bonding at die-bonding.net: Datacon develops, produces and distributes production equipment for the back-end market, called die bonding, for the processing of semiconductor chips.

Datacon Semiconductor & Die Bonding Equipment GmbH has produced production equipment for the semiconductor industry since its incorporation in 1986. The successful introduction of a unique new machine platform concept to the European market in 1995 and to the American and Asian markets in 1998 has transformed Datacon into a global player in the semiconductor industry. Datacon pioneered the concept of modularity and flexibility for the die bonding equipment market. Since 1998 Datacon has been active worldwide. The founding of Datacon Technology AG in 2000 enabled continued expansion. Since April 1, 2002 the complete Datacon Die Bonding product range has been directly marketed, distributed and technically supported by Datacon not only in Europe but also in North America and Asia. Today Datacon is one of the leading suppliers in the Die Bonding semiconductor industry.